Polyimide news

New polyimide sheet enables efficient microfabrication, reduces costs, and minimizes thermal stress in semiconductor manufacturing.

New bonding material enables thinner semiconductor wafers, enhancing AI, NAND, and power semiconductor performance while reducing environmental impact. Mass production set for 2028.

Doubling PIMEL™ capacity by 2030, driven by semiconductor demand, supports growth in electronics and generative AI sectors, with a ¥16 billion investment in Fuji City.

Zenimid™ offers top-tier polyimide performance for aerospace, automotive, and electronics, enhancing Arkema's polymer portfolio post-acquisition of PI Advanced Materials.