Key highlights
- Mass production of the polyimide sheet is set to begin in April 2026.
- The sheet allows microfabrication of redistribution layers and filling of TGVs with resin.
- It reduces thermal stress and costs by using photolithography and conformal plating.
- The sheet supports microvia processing below 10 microns in diameter.
Introduction
Toray Industries has developed a negative photo definable polyimide sheet for semiconductor manufacturing, aimed at improving efficiency and reducing costs.
Technological Advancements
The new sheet enables simultaneous microfabrication of redistribution layers and filling of through-glass via electrodes (TGVs) with resin, using photolithography. This approach reduces copper plating costs and minimizes thermal stress-induced glass cracking.
Material Benefits
The polyimide sheet supports microvia processing below 10 microns in diameter and reduces the elastic modulus by about one-third, addressing challenges like glass fractures from thermal stress.
Production Timeline
Substrate manufacturers are currently evaluating samples, with mass production scheduled to begin in April 2026.
