- Asahi Kasei combined PIMEL liquid PSPI and SUNFORT dry-film photoresist into a new PSPI film now under customer evaluation, with commercial availability expected in the near future.
- The film enables uniform lamination on large square panels and supports additional insulating layers for panel-level semiconductor packaging.
- Combined with SUNFORT TA (capable of 1.0 μm circuits) it enables fine circuit patterning via film lamination; combined with SUNFORT CX it supports forming high-aspect-ratio copper pillars for 3D packaging.
- Target uses include redistribution layers and insulating layers on package substrates to meet demands for finer wiring, more layers, larger interposers and higher-density chip packaging.
New PSPI film
Asahi Kasei combined its PIMEL liquid photosensitive polyimide and SUNFORT dry-film photoresist into a photosensitive polyimide (PSPI) film that is currently under customer evaluation, with commercial availability expected in the near future.
Technical capabilities
The film enables uniform lamination onto large square panels and supports additional insulating layers; when used with SUNFORT TA (capable of 1.0 μm-wide circuits) it allows both fine circuit patterning and insulating resin layers via film lamination, and pairing with SUNFORT CX targets formation of high-aspect-ratio copper pillars for 3D packaging.
Applications and market drivers
Targeted uses include redistribution layers and insulating layers on package substrates as packaging shifts from wafer- to panel-level: demand is rising for higher-density chip packaging, larger interposers, finer wiring patterns and more layering to meet AI and data-center semiconductor requirements.
