Arkema Introduces Zenimid™ for High-Performance Polyimides

Key highlights
  • Arkema acquired a 54% stake in PI Advanced Materials.
  • Zenimid™ is engineered for demanding environments with high heat and chemical resistance.
  • Applications include FPCBs, smart devices, BMS, and 5G infrastructure.
  • PI Advanced Materials leads in ultra-thin polyimide film with 4 μm thickness.

Introduction of Zenimid™

Arkema and PI Advanced Materials have launched Zenimid™, a new brand for their high-performance polyimide products. This initiative aims to expand the product's global presence in sectors like aerospace, automotive, electronics, and industrial applications.

Product Features

Zenimid™ Polyimide is designed for challenging environments, offering superior dimensional stability, flexibility, heat resistance, chemical resistance, and electrical insulation. It is available in various forms, including film, varnish, and stock shapes, and is used in applications such as flexible printed circuit boards (FPCBs), graphite sheets in smart devices, battery management systems (BMS), and 5G infrastructure.

Market Leadership

PI Advanced Materials is recognized as the first manufacturer of the world's non-stretched ultra-thin polyimide film, with a thickness of 4 micrometers. The company holds the largest market share in the global polyimide film market.

Strategic Acquisition

Following Arkema's acquisition of a 54% stake in PI Advanced Materials, Zenimid™ Polyimide strengthens Arkema's portfolio of high-performance polymers. This includes other flagship materials such as Rilsan® PA11, Rilsamid® PA12, Pebax® TPE, Kynar® PVDF, Orgasol® PA12 powders, and Kepstan® PEKK materials.

Source: Arkema

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