- Toray plans mass production of its new bonding material by 2028.
- The material is free of regulated substances like per- and poly-fluoroalkyl substances and N-methylpyrrolidone.
- The elastic modulus of the new material is 2.5 times higher than conventional options.
- The material reduces wafer thickness variation to below 1.0 micrometer.
Introduction
Toray Industries has developed a new semiconductor back-end process material for manufacturing ultra-thin wafers, essential for AI, NAND flash memory, and power semiconductors. The company has started shipping samples and plans mass production by 2028.
Technological Advancements
The new material features an elastic modulus 2.5 times higher than conventional materials, reducing wafer thickness variation to below 1.0 micrometer. This advancement is crucial as global data volumes grow by 30% annually, necessitating enhanced semiconductor performance.
Environmental Considerations
Toray's material is free from per- and poly-fluoroalkyl substances and N-methylpyrrolidone, which face increasing regulation due to environmental and health concerns. The company uses polyimide, a heat-resistant resin, in its development.
Industry Context
As miniaturization of transistors and wiring reaches physical limits, vertical integration technology is emerging to improve processing. High-bandwidth memory and NAND flash memory devices leverage this technology for superior performance.
