BASF launches GLYTHERMIN® coolants for liquid‑cooled data centers

Key highlights
  • Global data center capacity has nearly doubled over the past five years.
  • AI processors and GPUs can generate heat loads exceeding 150 kilowatts per rack, pushing air cooling to its limits.
  • Glythermin DC PG25 is qualified as an NVIDIA DSX Ready Coolant, meeting NVIDIA PG25 requirements for secondary‑loop, single‑phase cold‑plate cooling.
  • BASF positions propylene glycol formulations, advanced corrosion protection and backward integration as drivers of consistent quality and supply security.

Market pressure

Rapid AI and cloud growth is increasing data center capacity and rack power density, with GPUs and processors for AI workloads producing heat loads that can exceed 150 kilowatts per rack. Under these conditions, conventional air cooling is reaching its physical limits and operators are increasingly adopting direct liquid cooling (DLC).

Product platform

The Glythermin portfolio comprises Glythermin DC and Glythermin PG products tailored for primary‑loop and DLC applications. BASF combines propylene glycol chemistry with corrosion‑protection technologies to deliver heat‑transfer fluids formulated for long service life, reduced inhibitor consumption, and protection against corrosion, aging and deposit formation.

How it works

In DLC systems cold plates mounted on processors and GPUs transfer heat to a circulating coolant, which carries heat to a Coolant Distribution Unit (CDU) that controls flow, temperature and pressure. Liquid cooling enables significantly higher heat transfer than air cooling and supports high‑density infrastructures.

Qualification and supply

Glythermin DC PG25 has qualified as an NVIDIA DSX Ready Coolant, meeting applicable NVIDIA PG25 fluid requirements for secondary‑loop, single‑phase cold‑plate cooling. BASF highlights its global production footprint and backward integration across the value chain to ensure consistent quality and supply, and participates in industry bodies including the Open Compute Project, ASTM International and the GB Standard Committee in China.

Source: BASF

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