Mitsubishi Chemical commercializes ultra‑high‑purity colloidal silica
- Mitsubishi Chemical will commercialize ultra‑high‑purity colloidal silica for polishing agents and CMP slurries used in cutting‑edge semiconductors.
- New production facilities will be established at the Kyushu Plant (Fukuoka Area) in Kitakyushu and begin commercial operation in October 2028.
- The product is produced via an integrated process using ultra‑high‑purity tetramethoxysilane and can be customized for particle size and density to meet customer needs.
- The launch targets advanced semiconductor segments such as generative AI and data centers and aligns with the company’s KAITEKI Vision 35 focus on enabling advanced data processing and telecommunications.
Product and applications
Mitsubishi Chemical will commercialize ultra‑high‑purity colloidal silica intended as a raw material for surface polishing agents for silicon wafers and for chemical mechanical polishing (CMP) slurries used on interconnect layers. The material addresses requirements for high material removal rates, nanoscale surface flattening, minimal impurities and reduced scratches; particle shape and physical properties vary by application.
Manufacturing and specifications
The ultra‑high‑purity colloidal silica is produced through an integrated manufacturing process using ultra‑high‑purity tetramethoxysilane to minimize impurity content. The company says particle size and density can be customized to customer specifications based on its technical expertise.
Production timeline and strategic context
New production facilities will be established at the Kyushu Plant (Fukuoka Area) in Kitakyushu City, Fukuoka Prefecture, with commercial operations planned to start in October 2028. The move is positioned to supply materials for cutting‑edge semiconductor manufacturing as demand grows in areas such as generative AI and data centers, and aligns with the company's KAITEKI Vision 35 priority to enable advanced data processing and telecommunications.
Source: Mitsubishi
