- SABIC introduced LNP ELCRIN SLX2373RCC and SLX2375RCC compounds with 30% and 45% post‑consumer recycled (PCR) content for high‑gloss molded‑in‑color exterior parts.
- LNP KONDUIT WTF2C is a thermally conductive compound that can replace die‑cast aluminum in ADAS radar housings and ECUs while remaining compatible with laser welding and heat staking.
- EXTEM RH1017UCL is an optical thermoplastic that withstands lead‑free reflow soldering for optical sensor lenses and multigigabit vehicle connectivity.
- PIAE 2026 is scheduled for 18–19 March 2026 in Baden‑Baden, Germany.
PCR-based high-gloss compounds
SABIC introduced LNP ELCRIN SLX2373RCC and SLX2375RCC with 30% and 45% post‑consumer recycled (PCR) content; they offer weatherability and impact resistance for high‑gloss molded‑in‑color exterior parts, reduce the need for painting and facilitate end‑of‑life recycling; a shark‑fin antenna and heated ADAS radome using these materials were displayed.
Thermal management for ADAS
LNP KONDUIT WTF2C is a thermally conductive compound intended to replace die‑cast aluminum in radar housings and ECUs to reduce weight, system cost and emissions while enabling greater design flexibility; it is compatible with production methods including laser welding and heat staking.
Optical and high‑temperature polymers
EXTEM RH1017UCL is an optical thermoplastic compatible with lead‑free reflow soldering for sensor lenses and optical multigigabit connectivity; ULTEM resins withstand temperatures up to 230°C for complex modules such as digital matrix LED headlights, reduce outgassing and support direct metallization of lens barrels, spacers, brackets and reflectors.
Exterior lighting and design
LNP ELCRES SLX1271D copolymer enables UV‑resistant, paint‑free molded‑in diffusive high‑gloss surfaces for illuminated exterior elements, improving backlighting effects demonstrated in a front‑grille application.
EV battery energy absorber
A honeycomb energy absorber in NORYL GTX resin replaces metal for lightweight side‑impact protection inside rocker panels; it is injection molded for complex designs and delivers better low‑temperature ductility and higher modulus at elevated temperatures versus polyamide.
Event
PIAE 2026 took place in Baden‑Baden, Germany on 18–19 March 2026.
