Toppan Inc.

Japantoppan.com

Its role Developer

project tracked
1
partner companies
6
news articles
2

Toppan Inc. (凸版印刷株式会社) is a Japan-based global provider of printing, packaging, and advanced materials. The company develops and manufactures flexible packaging, paperboard packaging, and labels, with a strong portfolio of functional films such as transparent high‑barrier and metallized films used across food, beverage, personal care, and healthcare applications. Toppan’s materials technologies support shelf-life extension, product protection, and high-quality printability for converters and brand owners worldwide.

Read more

Core capabilities include polymer and coating science, thin‑film deposition, vapor barrier engineering, lamination, and precision converting. Toppan also advances mono-material and recyclability‑focused packaging structures and works to align with global food-contact and environmental standards. Beyond packaging, the company operates in electronics (e.g., photomasks and display-related materials) and security solutions, supported by a global manufacturing and R&D network.

Also known as TOPPAN PRINTING CO., LTD. and 凸版.

The project Toppan is involved in

chemXplore tracks 1 project involving Toppan, of which one is active.

NEDO quantum-computing materials development platform R&D, Japan
  1. Announced / Concept
  2. FEED / Pre-FID
  3. FID / Sanctioned
  4. Under Construction
  5. Commissioning & Start-up
Phase
Announced / Concept
Partners
AGC , Aisin , Asahi Kasei , DIC , NEDO , SoftBank

Toppan in chemical industry news

28 October 2026
Six Japanese firms (TOPPAN, AISIN, Asahi Kasei, SoftBank, AGC, DIC) to build quantum‑computing materials platform

NEDO‑selected R&D (FY2026–FY2028) will integrate quantum computing and AI to accelerate materials discovery and validate simulations with experiments across batteries, optics, superconductors and colorants.

18 February 2026
PureCycle and TOPPAN Partner for Sustainable Recycled Packaging Solutions

They developed a snack bar wrapper with 30% recycled content, targeting thermoforming applications to meet regulatory demands without compromising safety or performance.