Dow showcases AI thermal-management materials at COMPUTEX 2026
- Dow to exhibit AI cooling materials at COMPUTEX Taipei 2026, June 2–5, TaiNEX 2, Booth R3303a.
- Product highlights include DOWSIL ICL-1100 single-phase immersion fluid (flash point >200°C), DOWFROST LC 25 direct-to-chip coolant, and DOWFROST HD facility heat-transfer fluid.
- Also showcased: DOWSIL thermal interface materials, silicone thermally conductive adhesives and encapsulants, and silicone hot-melt technologies for packaging and MEMS sealing.
- Dr Myra Zhai to keynote "Cooling AI-generation data centres" on June 4, 15:30–15:55 in Conference Room 701, TaiNEX 2.
COMPUTEX presence
Dow will exhibit thermal-management materials for AI-driven computing at COMPUTEX Taipei 2026, June 2–5, Nangang Exhibition Center (TaiNEX 2), Booth R3303a.
Cooling fluids and coolants
Products include DOWSIL ICL-1100 single-phase immersion fluid (flash point >200°C) for immersion cooling; DOWFROST LC 25 for liquid‑cooled direct‑to‑chip cold plates with corrosion protection for high‑surface‑area copper; and DOWFROST HD for facility primary circuits offering corrosion protection, microbial control and extended fluid life; a Coolant Care Network concept is used to address secondary and primary loop management.
Thermal interface and packaging materials
DOWSIL thermal interface materials provide medium‑to‑high thermal conductivity, support thin bond lines and reworkability, and manage mechanical stress for AI server processors, power modules and optical transceivers (400G–800G–1.6T); silicone thermally conductive adhesives, encapsulants, hot‑melt technologies and MEMS sealing materials target heat transfer, adhesion, warpage reduction and long‑term protection in advanced packaging.
Forum session
Dr Myra Zhai will present "Cooling AI‑generation data centres" on June 4, 15:30–15:55 in Conference Room 701, TaiNEX 2.
Source: Dow Chemical
