- Air Liquide inaugurated a new Advanced Materials plant in Taichung, Taiwan on March 25, 2026, its first large-scale production site in Taiwan for advanced deposition and etching materials.
- The facility will produce highly engineered molecules for nano-scale processes, notably Atomic Layer Deposition (ALD), for next-generation AI and HPC chips.
- Air Liquide already operates 54 facilities in Taiwan serving the semiconductor industry and has invested more than €1 billion there since 2019.
- Localizing production in Taichung is intended to shorten supply chains and support customers' ramp-up to high-volume manufacturing and improved yields.
Inauguration
On March 25, 2026 Air Liquide opened its first large-scale Advanced Materials manufacturing plant in Taichung City, Taiwan.
Products and processes
The facility will produce highly engineered molecules for nano-scale processes such as Atomic Layer Deposition (ALD), supplying advanced deposition and etch materials for next-generation AI and high-performance computing chips.
Supply chain and collaboration
Localizing production near semiconductor manufacturers is intended to improve material reliability, shorten supply chains, enable closer customer collaboration and support ramp-up to high-volume manufacturing for improved yields.
Taiwan footprint
The plant complements an existing network of 54 facilities in Taiwan; the Group has been present nearly 40 years and invested more than €1 billion in the market since 2019.
